印刷电路板

De NoraDT®电镀阳极已成为制造HDI印刷电路板和半导体衬底的铜通孔填充电沉积工艺的主要选择。

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Uniform copper deposition, reliable via filling ability, elimination of surface roughness and high additive consumption make use of De Nora DT® anodes: our  solution for today’s challenge.

De Nora DT® anodes are offered in standard and custom design to ensure optimum performance:

  • Stable anode area providing uniform plating distribution and better via filling power;
  • Extremely low additive consumption and long service lifetime;
  • Improved plating bath life and performance by reducing additive by-products
  • Elimination of tedious anode maintenance;
  • Increased equipment uptime/capacity at high current density operation; 

De Nora also provides:

  • Total anode solution in combination with relevant additives and copper replenishment
  • Full scale engineering service for upgrading from soluble to insoluble process
  • Optimal anode configuration for existing plating line
  • Technical support in troubleshooting