Printed Circuit Board Production

DENORA DT^® plating anodes have become the primary choice in copper-via-filling and mSAP electrodeposition processes for manufacturing both HDI printed circuit boards and semiconductor substrates.

Uniform copper deposition, reliable via filling ability, elimination of surface roughness, and minimum additive consumption make DENORA DT^® anodes the solution for today’s challenge in the electronics industry.

DENORA DT^® anodes are offered in standard and custom designs to ensure optimum performance:

Uniform plating distribution and excellent throwing power
Extremely low additive consumption without membrane
Improved plating bath life with stable performance
Less bath maintenance by reducing toc
Long service life and elimination of anode maintenance
Increased equipment productivity by high current density operation

Discover more about our technologies

Submit an Inquiry

De Nora also provides:

Total anode solution in combination with relevant additives and copper replenishment
Full scale engineering service for upgrading from soluble to insoluble process
Optimal anode configuration for existing plating line
Technical support in troubleshooting
Customized offers, including leasing contracts and periodic monitoring of anodes performance
Recoating service

Our insoluble anodes are largerly applied by leading PCB manufacturers and are selected by equipment suppliers for their vertical continuous plating (VCP) lines and horizontal electroplating equipment. De Nora coatings, marketed under the DENORA DT^®brand, have been qualified by all main chemical vendors and are compatible with all plating chemicals, including the latest generation.